Physical Vapor Deposition (PVD) Systems
Deposition systems: sputter, e-beam, thermal, pulsed laser. Cluster tools and ion beam etching systems.
BesTec GmbH specialised in design and manufacturing of customer specific ultrahigh vacuum systems (UHV systems). The two main application areas are optical instruments for photon energies from the infrared to the hard X-ray range and fully automated deposition systems for production and optimization of functional layer systems.
Thermal Evaporation, E-Beam Evaporation, Organic Effusion Cell Deposition
Several deposition sources are possible in one chamber, incl. different type of sources.
Possible source types are e-beam evaporator, thermal evaporator, (organic) effusion cell deposition cluster, ion beam sputtering and others.
- Each source can be equipped with its own source shutter.
- Typical sample temperature of -100°C up to +1000°C possible.
- Continuous sample rotation possible.
- Typically full software control incl. automatic deposition process.
- Additional gas inlet at the chamber or manipulator possible.
- Ion source for sample precleaning, oxidation or ion beam assisted deposition.
- Motor driven wedge shutter.
- Thickness sensor for rate checking or regulation at beginning of deposition process as well as thickness endpoint detection.
- Pneumatic or motor driven source translation.
Sputter System
Bestec provides customized magnetron sputter systems with different possible sputter geometries, chamber base pressure and sample manipulation.
- Depending on user requests up to ten (tilt able) sputter sources are possible in one chamber.
- All sources can be driven with DC, RF or pulsed DC (incl. HiPIMS) generators.
- Each source has its own gas inlet close to the target and source shutter.
- Typical sample temperature: -100°C up to +1000°C.
- Continuous sample rotation.
- Typically full software control incl. automatic deposition process.
- RF- or DC switching unit to enable usage of one generator at more than one source.
- Sample bias.
- Additional gas inlet at the chamber or manipulator for reactive sputtering.
- Ion source for sample precleaning, oxidation or ion beam assisted deposition.
- Motor driven wedge shutter.
- Thickness sensor for sputter rate checking at beginning of deposition process.
- Pneumatic or motor driven sputter source tilting or translation.
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